Liquid-to-Chip Cooling: Digital Realty's Release on High-Density Deployment Support

On May 15, 2024, Digital Realty announced direct liquid cooling as an addition to its high-density colocation offering, with deployment options available in more than half of its data centers worldwide. It gives no count of racks in use.

Digital Realty describes itself as a provider of data center, colocation and interconnection solutions. On May 15, 2024 it put out a release headed "Digital Realty Unveils Advanced High-Density Deployment Support for Liquid-to-Chip Cooling." Parts of the release follow, not the whole.

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What Was Added

The new offering, the release says, "builds upon the company's standardized high-density colocation offering" and introduces direct liquid cooling, or DLC, "bringing liquid directly to customers' infrastructure." The release says the approach "enables businesses to deploy high-density configurations within a shared environment."

It speaks of the ability to use "a wide range of mechanical solutions, such as rear door heat exchangers (RDHx) and DLC," and says this enables "the efficient management of power densities ranging from 30 to 150 kilowatts per rack, and beyond." The combination of the two, in its words, "effectively doubles the power densities that can be supported." It does not give the density from which it doubles.

Where It Is Offered

Under its headline the release says the solution is "available in 170 Digital Realty data centers globally." Its body says deployment options are available in more than half of the company's data centers worldwide, "with plans to expand support to additional sites."

Its safe harbor statement says the release contains forward-looking statements, among them statements related to the company's growth prospects, strategy and customer demand.

The release reports where the option is available. How many racks run on liquid at those densities is a different number, and the release does not give it.

Sources

  1. Digital Realty Trust, Inc.. Digital Realty Unveils Advanced High-Density Deployment Support for Liquid-to-Chip Cooling. 15 May 2024. company filing